IEEE Switzerland Section

The IEEE Electronics Packaging Society (EPS) focuses on the scientific, engineering, and production aspects of materials, component parts, modules, hybrids and microelectronic systems for all electronic applications. This includes the technology, selection, modeling and simulation, characterization, application, assembly, interconnection, packaging, handling, thermal management, reliability, testing and control of the above as they apply in design and manufacturing. Examples are the packaging of optoelectronics and bioelectronic systems, as well as the adaptation for operation in severe and harsh environments. Emphasis is placed upon research, analysis, development and application and manufacturing technology that aid in advancing the state-of-art within this scope.

This is to be achieved by

• Setting-up and improving the contact between EPS Swiss members
• Organizing Conferences, Company visits and Presentations
• Exchanging activities with neighbouring chapters and the EPS headquarters

Company visit- Hitachi Semiconductor factory

14th December, 2023 @ Hitachi Energy Switzerland ltd., Lenzburg

Chiplet Design and Heterogenous Integration Packaging

20th April, 2023 @ ETH, Zürich

High-speed 400Gb/s transceiver with reduced manufacturing cost

Webinar, 13th December, 2022 

Precision Assembly in Photonics Packaging

Joint event with Swissphotonics, 24th February, 2022   @ CSEM SA,  Alpnach Dorf

SWISS IEEE EPS EVENT (WEBINAR)- High Thermal Conductivity Materials towards Efficient Thermal Management of Electronic Devices : Application and Modelling , Webinar, 30th September 2021

SWISS IEEE EPS EVENT (Webinar): Trends in Thermal Management of Electronic systems, Webinar,  09th June 2021