Electronics Packaging Society (EPS) Chapter

The IEEE Electronics Packaging Society (EPS) focuses on the scientific, engineering, and production aspects of materials, component parts, modules, hybrids and microelectronic systems for all electronic applications. This includes the technology, selection, modeling and simulation, characterization, application, assembly, interconnection, packaging, handling, thermal management, reliability, testing and control of the above as they apply in design and manufacturing. Examples are the packaging of optoelectronics and bioelectronic systems, as well as the adaptation for operation in severe and harsh environments. Emphasis is placed upon research, analysis, development and application and manufacturing technology that aid in advancing the state-of-art within this scope.

This is to be achieved by

  • Setting-up and improving the contact between EPS Swiss members
  • Organizing Conferences, Company visits and Presentations
  • Exchanging activities with neighbouring chapters and the EPS headquarters

 

Upcoming Events

Visit of Hitachi-ABB Power Grids Semiconductors  in Lenzburg (AG).

DATE: to be defined

Committee

We volunteer to bring you a good experience with our events.

Any suggestion feel free to contact us.

 

Chair

Rony Jose James

rony.josejames@csem.ch

CSEM SA
Untere Gruendlistrasse 1
6055 Alpnach Dorf, CH

Secretary

Slavo Kicin

slavo.kicin@hitachi-powergrids.com

Hitachi ABB Power Grids
Segelhofstrasse 1K
Aargau
5405 Baden-Daettwil, CH

Program Chair/Webmaster

Giovanni A. Salvatore

giovanni.salvatore@hitachi-powergrids.com

Hitachi ABB Power Grids
Segelhofstrasse 1K
Aargau
5405 Baden-Daettwil, CH

Past Events

Date

Location

Program

Title of the Seminar and Speaker

Gallery

Thursday, 24.10.2019

EMPA
Uberlandstrasse 129
8600 Dübendorf

Seminar and discussion

Electro-optical 3D Hetero-integration of multifunctional systems” by Prof. Karlheinz Bock

Thursday, 22.09.2018

IBM Research Zurich
Säumerstrasse 4
CH-8803 Rüschlikon

3 Seminars, discussion and tour of the Binnig and Rohrer Nanotechnology Center

  1. Functional Electronic Packaging” by Dr. Thomas Brunschwiler
  2. Neuromorphic Hardware” by Dr. Bert Jan Offrein
  3. Universal Quantum Computing” by Dr. Stefan Filipp