Events

Upcoming Events

DateEventPlaceProgram/Registration
Thursday,  November 22, 2018

EPS seminar on "Functional electronic packaging, from servers to neuromorphics and the quantume era" combined with elections to the Swiss IEEE EPS Chapter Board.
 

IBM Research, Säumerstrasse 4, CH-8803 Rüschlikon

Event flyer

Please, register by E-mail ASAP (rony.josejames@csem.ch).

Number of registrations is limited to 40!

  

Past Events

DateEventPlace/SpeakersProgram
Wednesday, June 13, 2018 EPS seminar on "Packaging of Electronic Devices".

Sonova AG, Laubisruetistrasse 28, 8712 Stäfa

Event flyer
Wednesday, May 3, 2017 Seminar - joint session of CPMT and Reliability chapter "Reliability of Electronic Devices" combined with CPMT General Assembly. EMPA Dübendorf, Überlandstrasse 129

VE102, Auditorium Dübendorf,

8600 Dübendorf

Event flyer

Getting there
Monday, November 28, 2016 Seminar - joint session of CPMT and Reliability chapter "Reliability of Electronic Devices" combined with CPMT General Assembly. ETH Zürich, ETZ Building (HG F 26.5)                    Gloriastrasse 35 8092 Zürich

Event flyer

Getting there
November 5, 2015

Genaral Assembly 2015

ABB Corporate Research Segelhofstrasse 1K       5405 Baden-Daettwil

Event flyer

Getting there

June 18, 2015

Seminar on "Packaging and Components for Medical and Pharmaceutical Devices"

Roche Diagnostics International      Arena, Building 5 Forrenstrasse 2    6343 Rotkreuz Event flyer with program

January 28, 2015

Seminar - joint session of CPMT and EMBS chapter "Electronic packaging for Active Implantable Medical Devices"

ETH Zürich Main Building,
HG F 26.5
Rämistrasse 101
8092 Zürich

Event Flyer with program &

several photos from the event.

June 25, 2014 Genaral Assembly and Paul Scherrer Institur (PSI) visit  Paul Scherrer Institur (PSI)
  • 14:30 Welcome address (Daniel Thommen)
  • 14:45 CPMT General Assembly
  • 15:30 Coffee break (at PSI Cafeteria)
  • 15:45 Short introduction of PSI
  • 16:15 Visit of PSI visitors centre with its interactive exhibits
  • 16:45 Tour at Large Scale Research Facilities (PSI)
  • 18:15 End
  • 18:30 Dinner at own expense at restaurant near by

Minutes of Meeting

General Assembly Presentation

more here...

September 30, 2013 Visit of Sensirion AG and General Assembly Sensirion AG, Staefa
  • General introduction to Sensirion by Marc von Waldkirch followed by a company tour guided by Werner Hunziker and Stephan Braun
  • Administrative part - chapter report by Chapter Chair Hamit Duran
  • Appero offered by Sensirion followed by a common dinner in Stäfa

Minutes of Meeting

General Assembly presentation

 

June 24, 2013 Seminar on Reliability of Electronic Components & Systems EMPA Duebendorf

Program

Presentations download:

 

Thursday, 25 October, 2012 Visit to Microdul AG and a talk on "Customized Wafer Prober with Highly Precise Temperature Chuck" Microdul AGGrubenstrasse 9
CH-8045 Zürich, Switzerland

More details & Minutes

Please register your participation hamit.duran@ch.abb.com

Wednesday, 16 May, 2012

Workshop on Optical packaging in cooperation with Swiss Photonics and Laser Network (SLN) CSEM SA, Alpnach Dorf, Switzerland Please register your participationhamit.duran@ch.abb.com

For details, See Registration & Program

Thursday, 30 June, 2011 Visit to Oclaro Switzerland AG and talk on ´VCSEL development and manufacturing; Packaging of High Power Laser Diodes`Details Oclaro Switzerland AG Talks, Discussions, General Assembly, Company tour and Dinner @ own expense 
Please register your participationhamit.duran@ch.abb.com
Thursday, 2 December, 2010 Seminar on "Thermal Management in Electronics Packaging"  EPFL, LTCM, Lausanne, Switzerland Talk, Discussions, Lab tour and Dinner @ own expense 
Please register your participationhamit.duran@ch.abb.com
Thursday, 23 September, 2010 Company Visit and talk on "State-of-the-Art Computer Packaging and Cooling" IBM Research Lab - Zurich Talk, Discussions, Lab tour, Apero and Dinner @ own expense 
Please register your participationhamit.duran@ch.abb.com
Monday, 14 December, 2009 Talk: "3 years Lead-free in Microelectronics": Review and Outlook Günter Grossmann, EMPA Talk, Discussions and Dinner @ own expense 
Please register your participationhamit.duran@ch.abb.com
Tuesday, 30 Juni, 2009 Company Visit and Annual Chapter Meeting Dyconex AG Company Presentation and Tour, Chapter GA and Apéro 
Please register your participation until 26.6.09:didier.cottet@ch.abb.com
Tuesday, 24 April, 2007 IEEE-CPMT Switzerland Workshop Didier Cottet (ABB), Gerhard Tröster (ETH Zurich), Herbert Keppner (FH Neuchâtel-Bern-Jura), Kurt Müri (Microdul AG) Workshop on Education in Electronics Packaging 
Please register your participation until 25. October:didier.cottet@ch.abb.com
Tuesday, 24 April, 2007 Annual Chapter Meeting and Company visit CSEM Alpnach Presentation of CSEM Activities including Lab Tour
Please register your participation until 17. April:didier.cottet@ch.abb.com
Tuesday, November 7, 2006 Company visit Norbert Galster Harting AG Production of electronic connectors and MID-devices (moulded interconnect) for micro packaging solutions.
Please register your participation until 31. October:didier.cottet@ch.abb.com
Tuesday, May 2, 2006 Annual Chapter Meeting and Presentation Dr.Marion Tobler-Rohr, Lecturer ETH and Hans Tobler, President IG exact General Assembly, 
"Ecodesign mit RoHS/WEEE - Konsequenzen für das Recycling" (German or English), 
"Die IG exact der Wirtschaftsverband der Elektronikindustrie" (German or English) 
and common Dinner
Thursday,
November 10, 2005
Annual Chapter Meeting and Company Visit Alexander Fach,
Didier Cottet,
ABB Corporate Research
Election of Didier Cottet as new Chapter Chair
Packaging of Power Electronics at ABB Corporate Research and Common Dinner
Tuesday,
May 17, 2005
Company Visit Kurt Mühlemann, Alphasem AG Substrates and Assembly at Microdul AG and Common Dinner
Wednesday,
September 8, 2004
Company Visit Dr. Oliver Carnal, Alphasem AG Presenstation of Alphasem AG and Common Dinner
Monday,
May 26, 2003
Annual Chapter Meeting Dr. Felix Mayer, CEO of SENSIRION AG Annual Meeting, Presenstation of Sensirion AG and Common Dinner
19.-21. March 2002 Course Prof. Dr. Gerhard Tröster High Density Packaging und MCM (in Deutsch)
10. October 2002 Conference Zeno Stössel Technology Leadership day 2002
5. December 2001 Visit Gerold Brändli Phonak AG
10. October 2001 Conference Zeno Stössel Technology Leadership day 2001
16. May 2001 Meeting Prof. Dr. Gerhard Tröster Annual Chapter Meeting with Talk of Hamit Duran
17. November 2000 Seminar Prof. Dr. Gerhard Tröster Advanced Packaging 3
5.-6. September 2000 Intensivkurs Prof. Dr. Gerhard Tröster Miniaturisierte Elektronik mit modernen Aufbautechniken 
- Entwicklung und Einsatz -
15. September 2000 Visit Dr. Jörg Jasper  
10. October 2000 Conference Zeno Stössel Technology Leadership day 2000
24. August 2000 Seminar Prof. Dr. Gerhard Tröster Advanced Packaging 2
6./7. July 2000 Seminar Prof. Dr. Gerhard Tröster Advanced Packaging
Monday 26. June 2000 Talk Dr. Eric Beyne, IMEC Belgium RF-"System-in-a-Package"